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Tech University of Korea

High Temperature
Interfacial Property Lab

해외

T. Kwack, H. Um, Y. Chung, "Dissolution Behavior of Alumina in Ladle Slag with Varying Slag Composition and Particle Size", ICS, 2025
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  • 2025-09-02 17:21:32

 

이전글 G. Kim, Y. Chung, "Dissolution Behavior of MgAl2O4 Spinel Inclusions in Mold Slags", ICS, 2025
다음글 N. Lee, Y. Chung, "The CaO Dissolution Behavior in CaO-SiO2-Al2O3-MgO Slags by Single Hot Thermocouple Technique(SHTT)", ICS, 2025
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